TC1174 데이터 시트보기 (PDF) - Microchip Technology

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TC1174

300mA CMOS LDO with Shutdown and VREF Bypass

Microchip Technology 

TC1174

6.3 Package Dimensions

Note: For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging

8-Pin MSOP

PIN 1

.122 (3.10) .197 (5.00)

.114 (2.90) .189 (4.80)

.026 (0.65) TYP.

.122 (3.10)

.114 (2.90)

.043 (1.10)

MAX.

6° MAX.

.016 (0.40) .006 (0.15)

.010 (0.25) .002 (0.05)

.028 (0.70)

.016 (0.40)

.008 (0.20)

.005 (0.13)

Dimensions: inches (mm)

DS21363C-page 8

 2002-2012 Microchip Technology Inc.

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