CPD07 데이터 시트보기 (PDF) - Central Semiconductor
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CPD07 Datasheet PDF : 2 Pages
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PROCESS CPD07
General Purpose Rectifier
8 Amp Glass Passivated Rectifier Chip
CentralTM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
GLASS PASSIVATED MESA
98 x 98 MILS
10.4 MILS
82.5 x 82.5 MILS
Au - 5,000Å
Au - 2,000Å
GROSS DIE PER 4 INCH WAFER
1,170
PRINCIPAL DEVICE TYPES
CR6A2GPP Series
BACKSIDE CATHODE
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
R2 (16-September 2003)
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