CX5000 데이터 시트보기 (PDF) - Unspecified

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CX5000

0.18um Structured ASIC

Unspecified 

CX5000:

0.18um Structured ASIC Product Family

I/O Ring

As shown in Figure 3, the CX5000 I/O ring is comprised of blocks of 8 metal programmable I/O drivers,

16 pads and ESD structures.

Each I/O structure may be split into one simple

input (CMOS or TTL) and one simple output

(CMOS or TTL) to maximize the chip’s signal I/O. In

cases where the cell is configured as a bi-

directional or an advanced single-ended I/O (e.g.,

PCI), the cell supports one signal only; the other

pad can be left unconnected or used for power.

Differential I/Os require two I/O structures per

channel and use two pads; the remaining two pads

are power or no-connect.

PLL,

Vb & Vref

I/O

Driver

Output

I/O

Driver

I/O

Driver

I/O

Driver

Input

&

VCC

Bidir

GND LVDS

Output

I/O

Driver

LVDS#

Customer

Core

Supported I/O

Figure 3. CX5000 I/O Structure

As shown in Table 4, the CX5000 family supports 676 simple I/O macrocells in addition to a number of

advanced I/Os based on popular industry standards.

© ChipX Inc.

5

CEC034 (9/20/05)

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