CXD1172 데이터 시트보기 (PDF) - Sony Semiconductor
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CXD1172 Datasheet PDF : 11 Pages
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Package Outline
Unit: mm
CXD1172AM
16PIN SOP (PLASTIC) 300mil
+ 0.4
9.9 – 0.1
16
9
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
8
1.27
+ 0.1
0.2 – 0.05
± 0.12 M
SONY CODE
EIAJ CODE
SOP-16P-L01
∗SOP016-P-0300-A
JEDEC CODE
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
0.2g
CXD1172AP
16PIN DIP (PLASTIC)
+ 0.4
19.2 – 0.1
16
9
1
8
2.54
0° to 15°
CXD1172AM/AP
0.5 ± 0.1
1.2 ± 0.15
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-16P-01
DIP016-P-0300
Similar to MO-001-AE
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
PACKAGE MASS
COPPER ALLOY
1.0 g
– 11 –
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