CXG1111EN 데이터 시트보기 (PDF) - Sony Semiconductor
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CXG1111EN Datasheet PDF : 6 Pages
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Package Outline
Unit: mm
2.5
A
10
6
10PIN VSON(PLASTIC)
+ 0.1
0.8 – 0.05
0.6
0.05 S
S
PIN 1 INDEX
1
0.8
5
0.4
B
x2
0.15 S B
x4
0.15 S A B
0.05 M S AB
0.35 ± 0.1
Kokubu Ass’y
SONY CODE
EIAJ CODE
JEDEC CODE
VSON-10P-01
Solder Plating
0.13 ± 0.025
+ 0.09
0.14 – 0.03
TERMINAL SECTION
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.013g
2.5
A
10
6
10PIN VSON(PLASTIC)
+ 0.1
0.8 – 0.05
0.6
0.05 S
S
PIN 1 INDEX
1
0.8
5
0.4
B
x2
0.15 S B
x4
0.15 S A B
0.05 M S AB
0.35 ± 0.1
Solder Plating
0.13 ± 0.025
+ 0.09
0.14 – 0.03
TERMINAL SECTION
SONY CODE
EIAJ CODE
JEDEC CODE
VSON-10P-01
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.013g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
–6–
CXG1111EN
Sony Corporation
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