CY2309NZ(2004) 데이터 시트보기 (PDF) - Cypress Semiconductor
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CY2309NZ Datasheet PDF : 5 Pages
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CY2309NZ
Package Diagram
16 Lead (150 Mil) SOIC
16-Lead (150-Mil) SOIC S16
PIN 1 ID
8
1
DIMENSIONS IN INCHES[MM] MIN.
REFERENCE JEDEC MS-012
0.150[3.810]
0.157[3.987]
0.230[5.842]
0.244[6.197]
PACKAGE WEIGHT 0.15gms
PART #
S16.15 STANDARD PKG.
9
16
SZ16.15 LEAD FREE PKG.
MAX.
0.386[9.804]
0.393[9.982]
SEATING PLANE
0.010[0.254] X 45°
0.016[0.406]
0.050[1.270]
BSC
0.0138[0.350]
0.0192[0.487]
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.004[0.102]
0.0098[0.249]
0° ~8°
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
51-85068-*B
All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-07182 Rev. *C
Page 4 of 5
© Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
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