CY7C1338G
Capacitance[10]
Parameter
Description
CIN
CCLK
CI/O
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Thermal Resistance[10]
Test Conditions
TA = 25°C, f = 1 MHz,
VDD = 3.3V.
VDDQ = 3.3V
Parameter
ΘJA
ΘJC
Description
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Test Conditions
Test conditions follow standard test
methods and procedures for
measuring thermal impedance, per
EIA/JESD51.
100 TQFP
Max.
5
5
5
100 TQFP
Package
30.32
6.85
119 BGA
Max.
Unit
5
pF
5
pF
7
pF
119 BGA
Package
34.1
14.0
Unit
°C/W
°C/W
AC Test Loads and Waveforms
3.3V I/O Test Load
OUTPUT
Z0 = 50Ω
3.3V
OUTPUT
RL = 50Ω
5 pF
2.5V I/O Test Load
VT = 1.5V
(a)
INCLUDING
JIG AND
SCOPE
OUTPUT
Z0 = 50Ω
2.5V
OUTPUT
RL = 50Ω
5 pF
VT = 1.25V
(a)
INCLUDING
JIG AND
SCOPE
R = 317Ω
R = 351Ω
VDDQ
GND
ALL INPUT PULSES
10%
90%
≤ 1 ns
90%
10%
≤ 1 ns
(b)
(c)
R = 1667Ω
R =1538Ω
VDDQ
GND
ALL INPUT PULSES
10%
90%
≤ 1ns
90%
10%
≤ 1ns
(b)
(c)
Note:
10. Tested initially and after any design or process change that may affect these parameters.
Document #: 38-05521 Rev. *D
Page 9 of 17
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