DA108S 데이터 시트보기 (PDF) - STMicroelectronics

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DA108S

Diode Array

STMicroelectronics 

Package mechanical data

3

Package mechanical data

DA108S1 / DA112S1

● Epoxy meets UL94, V0

Table 4. SO-8 Dimensions

ccc C

b

C

(Seating

Plane)

C

k

A2 A

e

A1

h x 45°

0.25mm

(Gage Plane)

L

L1

D

8

5

E1

E

1

4

Dimensions

Ref.

Millimeters

Inches

Min. Typ. Max. Min. Typ. Max.

A

A1 0.1

1.75

0.25 0.004

0.069

0.010

A2 1.25

b 0.28

C 0.17

0.049

0.48 0.011

0.23 0.007

0.019

0.009

D 4.80 4.90 5.00 0.189 0.193 0.197

E 5.80 6.00 6.20 0.228 0.236 0.244

E1 3.80 3.90 4.00 0.150 0.154 0.157

e

1.27

0.050

h 0.25

0.50 0.010

0.020

L 0.40

1.27 0.016

0.050

L1

1.04

0.041

k° 0

8

0

8

ccc

0.10

0.004

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

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