DAN217U-TP 데이터 시트보기 (PDF) - Micro Commercial Components
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DAN217U-TP Datasheet PDF : 3 Pages
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MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
!"#
$% !"#
DAN217U
Features
• Low Current Leakage
• Low Cost
• Small Outline Surface Mount Package
• Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
C/A
• Moisture Sensitivity Level 1
Pin Configuration
Top View
A7
Maximum Ratings
• Operating Temperature: -40°C to +150°C
• Storage Temperature: -55°C to +150°C
A
C
Electrical Characteristics @ 25°C Unless Otherwise Specified
Parameter
Symbol
Limits
Unit
Peak reverse voltage
VRM
80
V
DC reverse voltage
VR
80
V
Maximum forward current
IFM
300
mA
Average forward current
IO
100
mA
Surge current
IFSM
1000
mA
Power dissipation
PD
200
mW
Junction temperature
Tj
150
ć
Parameter
Symbol Test conditions MIN
Reverse breakdown voltage VBR
IR=100uA
80
Reverse voltage leakage
current
IR
VR=70V
Forward voltage
VF
IF=100mA
MAX
0.2
1200
UNIT
V
uA
mV
200mW 80Volt
Plastic-Encapsulate
Diode
SOT-323
A
D
BC
F
E
G
H
J
K
DIMENSIONS
INCHES
MM
DIM
MIN
MAX
MIN
MAX
A
.071
.087
1.80
2.20
B
.045
.053
1.15
1.35
C
.079
.087
2.00
2.20
D
.026 Nominal
0.65Nominal
E
.047
.055
1.20
1.40
F
.012
.016
.30
.40
G
.000
.004
.000
.100
H
.035
.039
.90
1.00
J
.004
.010
.100
.250
K
.012
.016
.30
.40
Suggested Solder
Pad Layout
0.70
0.90
1.90
NOTE
Revision: A
0.65
0.65
www.mccsemi.com
1 of 3
2011/01/01
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