AP105-DF20-2830S 데이터 시트보기 (PDF) - HIROSE ELECTRIC

부품명

상세내역

제조사

AP105-DF20-2830S

1 mm Pitch Double Rows Low Profile Board-to-Cable Connectors

HIROSE ELECTRIC 

BUsage recommendation

1. Recommended Soldering

Temperature Profile for IR Reflow.

Temperature

IR Reflow

Preheating: 150°C for 60 sec. to 120 sec.

Soldering: 235°C±5°C for 10 sec. max.

... Maximum 240°C 220°C min.

10s to 30s ... 220°C

Maximum 240°C

220°C

Preheating

Soldering

Note 1: Up to 2 cycles of reflow soldering are possible under the same conditions, provided

that there is a return to normal temperature between the first and second cycle.

Note 2: The temperature indicates the board surface temperature at the points of contacts

with the connector terminals.

2.Recommended Manual Soldering Conditions Soldering temperature: 290°C ±10°C, Soldering time: within 3 sec.

3. Recommended Solder Screen Thickness 0.15mm

4. Board Warping

Maximum of 0.03 mm at the connector center section, with both ends of the connector as reference points.

5. Cleaning Conditions

Refer to "Nylon Connector Use Handbook."

6. Wiring Termination Conditions

Refer to "Nylon Connector Use Handbook."

Crimp contacts should be handled with care as not to cause any deformation or damage

affecting the performance or termination.

7. Mating / un-mating precautions Excessive twisting and pulling on wires during mating/un-mating should be avoided as it

may cause damage to connectors.

7

Share Link: