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DF61-2S-13C 데이터 시트보기 (PDF) - HIROSE ELECTRIC

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DF61-2S-13C Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Operating Precautions
1. Recommended Temperature Profile
(Lead-free soldering possible)
DF61 SeriesBoard-to-Wire Swing-Lock Connector for Low-Profile Power Source
250
200
150
220ç
180ç
10sec MAX
MAX 250�
100
50
0
TIMEsec
90120sec
60sec MAX
PRE-HEATING TIME SOLDERING TIME
[Applicable Conditions]
1. Peak Temperature: MAX 250
2. Heated Area: 220or above, within 60 sec.
3. Pre-heating Area: 150-180, 90-120 sec.
4. Number of Operation: Twice or less
* The contact lead area was measured.
The conditions may change depending on the types and manufacturers of
cream solder, PCB size, and conditions of other materials used for soldering.
Please fully check the soldering condition before use.
[Remarks 1] This temperature profile is our recommended value.
2. Recommended Hand Solder Conditions
3. Recommended Screen Thickness, Aperture
Opening Rate (Pattern Area Ratio)
4. PCB Warpage
5. Cleaning Condition
6. Precautions
Soldering iron temperature: 350 ± 10, soldering time: within 3 seconds
Thickness 0.1 mm, aperture opening rate: 100%
Max 0.02 mm at the center of connector with the both edges of the connector as
the baseline
Cleaning with IPA is possible. (Cleaning is not recommended as it may change
the feel of insertion/extraction, etc. Please consult with us when using other types
of cleaning agents.)
In order to maintain the performance reliability, do not insert the crimp contact
into the crimp socket at a slant angle.
Insertion/extraction of the connector while not mounted to the PCB may cause
breakage or deformation to the contact.
Extracting the connector by holding the cable could result in a breakage.
Do not apply flux at the time of hand soldering, as it may result in flux rise.
This product may have slightly different hue on molded items, however, they do
not affect the product performance.
See the separate“DF59 Insertion/Extraction Procedure Manual” for handling
precautions at the time of insertion and extraction.
7

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