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DG3000DB 데이터 시트보기 (PDF) - Vishay Semiconductors

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DG3000DB Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
PACKAGE OUTLINE
MICRO FOOT: 6−BUMP (2 X 3, 0.5−mm PITCH)
DG3000
Vishay Siliconix
6 O 0.150 X 0.180
Note 2
Solder Mask O X 0.280
0.5
0.5
Recommended Land Pattern
A
A2
A1
Index-Bump A1
Note 3
b Diameter
3
2
XXX
3000
Top Side (Die Back)
e
S
S
e
D
NOTES (Unless Otherwise Specified):
1. Bump is Eutectic 63/57 Sn/Pb.
2. Non-solder mask defined copper landing pad.
3. Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.
Silicon
Bump
Note 1
1
A
E
B
Dim
A
A1
A2
b
D
E
e
S
MILLIMETERS*
Min
Max
0.615
0.715
0.140
0.190
0.475
0.525
0.180
0.250
1.555
1.585
1.055
1.085
0.5 BASIC
0.278
0.293
INCHES
Min
Max
0.0242
0.0281
0.0055
0.0075
0.0187
0.0207
0.0071
0.0098
0.0612
0.0624
0.0415
0.0427
0.0197 BASIC
0.0109
0.0115
* Use millimeters as the primary measurement.
Document Number: 71742
S-21483Rev. C, 26-Aug-02
www.vishay.com
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