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DG3001 데이터 시트보기 (PDF) - Vishay Semiconductors

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DG3001 Datasheet PDF : 12 Pages
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DG3001, DG3002, DG3003
Vishay Siliconix
ORDERING INFORMATION
Temp. Range
Package
- 40 °C to 85 °C
MICRO FOOT: 6/-Bump 3 x 2, 0.5-mm pitch, 165 µm nom. bump height
(Eutectic, SnPb)
MICRO FOOT: 6-Bump 3 x 2, 0.5-mm pitch,
238 µm nom. bump height (Lead (Pb)-free, Sn/Ag/Cu)
Part Number
DG3001DB-T1
DG3002DB-T1
DG3003DB-T1
DG3001DB-T1-E1
DG3002DB-T1-E1
DG3003DB-T1-E1
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Limit
Unit
Reference V+ to GND
IN, COM, NC, NOa
- 0.3 to + 6
V
- 0.3 to (V+ + 0.3 V)
Continuous Current (NO, NC, COM)
Peak Current (Pulsed at 1 ms, 10 % duty cycle)
± 250
mA
± 400
Storage Temperature
(D Suffix)
- 65 to 150
Package Reflow Conditionsb
IR/Convection
VPR (Eutectic)
(Eutectic)
(Lead (Pb)-free)
215
°C
220
250
Power Dissipation (Packages)c
6-Bump, 2 x 3 MICRO FOOTd
250
mW
Notes:
a. Signals on NC, NO, or COM or IN exceeding V+ will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
b. Refer to IPC/JEDEC (J-STD-020A)
c. All bumps soldered to PC board.
d. Derate 3.1 mW/°C above 70 °C.
www.vishay.com
2
Document Number: 72505
S11-0303-Rev. D, 28-Feb-11

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