EL5411T 데이터 시트보기 (PDF) - Intersil

부품명

상세내역

제조사

EL5411T

60MHz Rail-to-Rail Input-Output Operational Amplifier

Intersil 

EL5411T

Package Outline Drawing

M14.173A

14 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)

Rev 1, 9/09

A

13

5.00 ±0.10

14

8

SEE

DETAIL "X"

6.40

4.40 ±0.10

2

3

PIN #1

I.D. MARK

3.00 ±0.10

3.20 ±0.10

1

7

0.20 C B A

0.65

TOP VIEW

B

0.09-0.20

END VIEW

EXPOSED THERMAL PAD

BOTTOM VIEW

H

0.05

C

SEATING

PLANE

0.10 C

1.20 MAX

0.25 +0.05/-0.06 5

0.10 CBA

SIDE VIEW

1.00 REF

0.90 +0.15/-0.10

0.05 MIN

0.15 MAX

DETAIL "X"

GAUGE

PLANE

0.25

0°- 8°

0.60 ±0.15

(5.65)

(1.45)

(0.65 TYP)

(0.35 TYP)

TYPICAL RECOMMENDED LAND PATTERN

NOTES:

1. Dimension does not include mold flash, protrusions or gate burrs.

Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.

2. Dimension does not include interlead flash or protrusion. Interlead

flash or protrusion shall not exceed 0.25 per side.

3. Dimensions are measured at datum plane H.

4. Dimensioning and tolerancing per ASME Y14.5M-1994.

5. Dimension does not include dambar protrusion. Allowable protrusion

shall be 0.80mm total in excess of dimension at maximum material

condition. Minimum space between protrusion and adjacent lead is 0.07mm.

6. Dimension in ( ) are for reference only.

7. Conforms to JEDEC MO-153, variation ABT-1.

16

FN6837.1

October 8, 2009

Share Link: