EL5325 데이터 시트보기 (PDF) - Intersil
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EL5325 Datasheet PDF : 11 Pages
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EL5325
when sourcing, and:
PDMAX = VS × IS + Σ(VOUTi × ILOADi)
when sinking.
Where:
• i = 1 to total 12
• VS = Supply voltage
• IS = Quiescent current
• VOUTi = Output voltage of the i channel
• ILOADi = Load current of the i channel
By setting the two PDMAX equations equal to each other, we
can solve for the RLOADs to avoid the device overheat. The
package power dissipation curves provide a convenient way
to see if the device will overheat.
The EL5325 has an internal thermal shutdown circuitry that
prevents overheating of the part. When the junction
temperature goes up to about 150°C, the part will be
disabled. When the junction temperature drops down to
about 120°C, the part will be enabled. With this feature, any
short circuit at the outputs will enable the thermal shutdown
circuitry to disable the part.
POWER SUPPLY BYPASSING AND PRINTED CIRCUIT
BOARD LAYOUT
Good printed circuit board layout is necessary for optimum
performance. A low impedance and clean analog ground
plane should be used for the EL5325. The traces from the
two ground pins to the ground plane must be very short. The
thermal pad of the EL5325 should be connected to the
analog ground plane. Lead length should be as short as
possible and all power supply pins must be well bypassed. A
0.1µF ceramic capacitor must be place very close to the VS,
VREFH, VREFL, and CAP pins. A 4.7µF local bypass
tantalum capacitor should be placed to the VS, VREFH, and
VREFL pins.
APPLICATION USING THE EL5325
In the first application drawing, the schematic shows the
interconnect of a pair of EL5325 chips connected to give
12 gamma corrected voltages above the VCOM voltage, and
12 gamma corrected voltages below the VCOM voltage.
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