EMIF02-USB05C2 데이터 시트보기 (PDF) - STMicroelectronics

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EMIF02-USB05C2

2 line EMF filter including ESD protection

STMicroelectronics 

EMIF02-USB05C2

3

Package information

Figure 8. Flip-Chip package dimensions

500 µm ± 10

315 µm ± 50

Package information

690 µm ± 65

0.92 mm ± 50 µm

Figure 9. Foot print recomendations Figure 10. Marking

Copper pad Diameter:

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 315 µm copper pad diameter

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

E

xxz

y ww

Figure 11. Flip-Chip tape and reel specification

Dot identifying Pin A1 location

4 +/- 0.1

Ø 1.5 +/- 0.1

0.73 +/- 0.05

All dimensions in mm

4 +/- 0.1

User direction of unreeling

5/7

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