EMIF02-USB05C2 데이터 시트보기 (PDF) - STMicroelectronics
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EMIF02-USB05C2 Datasheet PDF : 7 Pages
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Ordering information
EMIF02-USB05C2
Note:
More packing information is available in the application notes
AN1235: “Flip-Chip: Package description and recommendations for use”
AN1751: “EMI Filters: Recommendations and measurements”
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
4
Ordering information
Ordering code
EMIF02-USB05C2
Marking
GV
Package
Flip-Chip
Weight
2.7 mg
Base qty
5000
Delivery mode
Tape and reel 7”
5
Revision history
Date
14-Mar-2005
13-Nov-2006
Revision
Changes
1
Initial release.
2
Reformatted to current standards. Modified functional diagram on
page 1 to show connections. Updated Aplac model information.
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