EMIF04-10006F1 데이터 시트보기 (PDF) - STMicroelectronics

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EMIF04-10006F1

4 LINES EMI FILTER AND ESD PROTECTION

STMicroelectronics 

EMIF04-10006F2

Figure 11: Order code

EMIF yy - xxx zz Fx

EMI Filter

Number of lines

Information

x = resistance value (Ohms)

z = capacitance value / 10(pF)

or

3 letters = application

2 digits = version

Package

F = Flip-Chip

x = 1: 500µm, Bump = 315µm

= 2: Leadfree Pitch = 500µm, Bump = 315µm

Figure 12: FLIP-CHIP Package Mechanical Data

500µm ± 50

250µm ± 50

315µm ± 50

650µm ± 65

2.92mm ± 50µm

Figure 13: Foot print recommendations

Copper pad Diameter :

250µm recommended , 300µm max

Solder stencil opening : 330µm

Solder mask opening recommendation :

340µm min for 300µm copper pad diameter

Figure 14: Marking

Dot, ST logo

xx = marking

z = packaging

location

yww = datecode

(y = year

ww = week)

All dimensions in µm

545

400

E

xxz

y ww

5/7

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