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ESD11B 데이터 시트보기 (PDF) - ON Semiconductor

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ESD11B Datasheet PDF : 6 Pages
1 2 3 4 5 6
ESD11B
ESD Protection Diode
MicroPackaged Diodes for ESD Protection
The ESD11B Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size, it is suited for use in
cellular phones, MP3 players, digital cameras and many other portable
applications where board space comes at a premium.
Specification Features
Low Capacitance 12 pF
Low Clamping Voltage
Small Body Outline Dimensions: 0.60 mm x 0.30 mm
Low Body Height: 0.3 mm
Standoff Voltage: 5.0 V
Low Leakage
Response Time is < 1 ns
IEC6100042 Level 4 ESD Protection
IEC6100044 Level 4 EFT Protection
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 3 Requirements
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 6100042 (ESD)
Contact
Air
±15
kV
±15
Total Power Dissipation on FR5 Board
(Note 1) @ TA = 25°C
Thermal Resistance, JunctiontoAmbient
Junction and Storage Temperature Range
Lead Solder Temperature Maximum
(10 Second Duration)
°PD°
RqJA
TJ, Tstg
TL
250
mW
400
°C/W
40 to +125 °C
260
°C
Peak Pulse Current, 8 x 20 ms double
Ipp
2.0
A
exponential waveform (Figure 5)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR5 = 1.0 x 0.75 x 0.62 in.
www.onsemi.com
DSN2
CASE 152AA
MARKING
DIAGRAM
PIN 1
XXXX
YYY
XXXX = Specific Device Code
YYY = Year Code
ORDERING INFORMATION
Device
Package
Shipping
ESD11B5.0ST5G DSN2 5000/Tape & Reel
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2015
1
October, 2017 Rev. 7
Publication Order Number:
ESD11B/D

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