ESDALY(2012) 데이터 시트보기 (PDF) - STMicroelectronics

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ESDALY
(Rev.:2012)

Automotive dual Transil™ array for ESD protection

STMicroelectronics 

Recommendation on PCB assembly

ESDALY

5.3

PCB design preference

1. To control the solder paste amount, the closed via is recommended instead of open

vias.

2. The position of tracks and open vias in the solder area should be well balanced. The

symmetrical layout is recommended, in case any tilt phenomena caused by

asymmetrical solder paste amount due to the solder flow away.

5.4

Reflow profile

Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)

250

200

150

240-245 °C

2 - 3 °C/s

60 sec

(90 max)

-2 °C/s to

-3 °C/s

-6 °C/s max

100

0.9 °C/s

50

Time (s)

0

30

60

90 120 150 180 210 240 270 300

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

8/10

Doc ID 022075 Rev 1

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