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ESD9L 데이터 시트보기 (PDF) - ON Semiconductor

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ESD9L
ON-Semiconductor
ON Semiconductor ON-Semiconductor
ESD9L Datasheet PDF : 4 Pages
1 2 3 4
ESD9L, SESD9L Series
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra−Low
Capacitance
The ESD9L Series is designed to protect voltage sensitive components
that require ultra−low capacitance from ESD and transient voltage
events. Excellent clamping capability, low capacitance, low leakage, and
fast response time, make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs such as USB 2.0 high speed and
antenna line applications.
www.onsemi.com
1
2
PIN 1. CATHODE
2. ANODE
Specification Features:
Ultra Low Capacitance 0.5 pF
Low Clamping Voltage
Small Body Outline Dimensions:
0.039x 0.024(1.00 mm x 0.60 mm)
Low Body Height: 0.016(0.4 mm)
Stand−off Voltage: 3.3 V, 5 V
Low Leakage
Response Time is Typically < 1.0 ns
IEC61000−4−2 Level 4 ESD Protection
S and SZ Prefixes for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
2
1
SOD−923
CASE 514AB
MARKING DIAGRAM
1
XM
2
X = Specific Device Code
M = Date Code
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
±10
kV
±15
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
°PD°
Tstg
TJ
TL
150
mW
−55 to +150 °C
−55 to +150 °C
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping
ESD9LxxxST5G
SOD−923 8000/Tape & Reel
(Pb−Free)
SESD9LxxxST5G SOD−923 8000/Tape & Reel
(Pb−Free)
SZESD9LxxxST5G SOD−923 8000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2017
1
January, 2017 − Rev. 6
Publication Order Number:
ESD9L/D

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