TDA7267A 데이터 시트보기 (PDF) - STMicroelectronics

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TDA7267A

3W MONO AMPLIFIER

STMicroelectronics 

THERMAL DATA

Symbol

Rth j-amb

Rth j-case

Parameter

Thermal Resistance Junction to ambient

Thermal Resistance Junction to case

TDA7267A

Value

70

15

Unit

°C/W

°C/W

ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = 14.5V; RL = 8Ω; f = 1KHz; unless otherwise

specified.)

Symbol

VS

IS

Isb

VO

AV

RIN

PO

THD

SVR

Parameter

Supply Voltage Range

Quiescent Current

Stand-By Current

Quiescent Output Voltage

Voltage Gain

Input Impedance

Output Power

Distortion

Supply Voltage Rejection

EI

Input Noise Voltage

Vsb

Stand-By Enable Voltage

Test Condition

Min.

5

Pin 3 shorted to GND

31

50

THD = 10%

2.7

PO = 1W

Vripple = 150mVrms;

Fripple = 1KHz

Rg = 10KΩ; BW = 20Hz to 20KHz

Typ.

23

7.5

100

3

0.1

50

5

Max.

18

35

0.3

33

0.3

10

1

Unit

V

mA

mA

V

dB

KΩ

W

%

dB

µV

V

Figure 1. Application Circuit

IN

STAND-BY

C1 0.1µF

IN 4

SVR

3

C3

47µF

VS

1

6

2

9 to 16

C4

100µF

C5 470µF

OUT

8Ω

S-GND

P-GND

D98AU828

VS=14.5V

APPLICATION HINTS:

For 14.5V supply and 8Ω speaker application, its

maximum power dissipation is about 1.8W.

Assumming that max ambient temperature is

70°C, the required thermal resistance of the de-

vice mounted on the PCB with a dissipating area

must be equal to: (150 - 70)/1.8 = 44.4°C/W.

Junction to pin thermal resistance of the package

is about 15°C/W. That means external heat sink

of about 30°C/W is required.

Cu ground plane of PCB can be used as heat dis-

sipating means.

3/7

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