FAN2560(2008) 데이터 시트보기 (PDF) - Fairchild Semiconductor
부품명
상세내역
제조사
FAN2560 Datasheet PDF : 12 Pages
| |||
Physical Dimensions
BALL A1
INDEX AREA
0.03 C
2X
F
E
A
TOP VIEW
B
DF
0.03 C
2X
(Ø0.25)
Cu PAD
A1
(0.433)
(0.50)
(0.866)
(Ø0.35)
SOLDER MASK
OPENING
RECOMMENDED LAND PATTERN (NSMD)
0.05 C
0.06 C
0.625 MAX E
0.332±0.018
0.250±0.025
D
C
SEATING PLANE
SIDE VIEWS
(X)+/-.018 F
0.50
0.005 C A B
0.50 5 X Ø0.315 +/- .025
C
B
0.433
A
F (Y)+/-.018
123
BOTTOM VIEW
A. NO JEDEC REGISTRATION APPLIES
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994
D DATUM C, THE SEATING PLANE, IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
E PACKAGE TYPICAL HEIGHT IS 582 MICRONS
+/- 43 MICRONS (539-625 MICRONS)
F FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. BALL COMPOSITION: Sn95.5Ag3.9Cu0.6
SAC405 ALLOY
H. DRAWING FILENAME: MKT-UC005AArev5
Figure 26. Wafer-Level Chip-Scale Packaging (WLCSP)
Product Specific Dimensions
Product
FAN2560UC13X
FAN2560UC15X
D
0.960 +/- 0.030
0.960 +/- 0.030
E
1.330 +/- 0.030
1.330 +/- 0.030
X
0.230
0.230
Y
0.232
0.232
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
© 2006 Fairchild Semiconductor Corporation
FAN2560 • Rev. 1.0.0
10
www.fairchildsemi.com
Share Link: 