FODM121E 데이터 시트보기 (PDF) - Fairchild Semiconductor
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FODM121E Datasheet PDF : 10 Pages
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Footprint Drawing for PCB Layout
0.80
1.00
6.50
2.54
Note:
All dimensions are in mm.
Recommended Infrared Reflow Soldering Profile
300
250
200
150
100
50
0
0
• Peak reflow temperature: 260°C (package surface temperature)
• Time of temperature higher than 245°C: 40 seconds or less
• Number of reflows: 3
10 s
260°C
245°C
40 s
50
100
150
200
250
300
Time (s)
FODMX Rev. 1.0.7
9
www.fairchildsemi.com
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