Evaluation Board Layout
FPF1005/6 Demo board has the components and circuitry to demonstrate the load switch functions. Thermal performance of the load
switch can be improved significantly by connecting the middle pad (pin 7) to the GND area of the PCB.
Figure 19. Demo board silk screen top
and component assembly drawing.
Figure 20. Demo board top layer view. Figure 21. Demo board bottom layer view.
Dimensional Outline and Pad Layout
NOTES:
A. NON-CONFORMS TO JEDEC REGISTRATION.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994
FPF1005-FPF1006 Rev.E
8
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