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FSA1259 데이터 시트보기 (PDF) - Fairchild Semiconductor

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FSA1259 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
Physical Dimensions
0.15
8
3.1±.1
1.55
1
PIN #1 IDENT.
5
-B-
2.3±0.1
4
0.2 C B A
ALL LEAD TIPS
1.80
0.70
1.00
0.5 TYP
0.30 TYP
0.90 MAX
ALL LEAD TIPS
0.1 C
0.70±0.10
-C-
0.50TYP
0.10
0.00
0.17-0.27
0.13 A B C
DETAIL A
0.10-0.18
0.4 TYP
A. CONFORMS TO JEDEC REGISTRATION MO-187
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS.
D. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M, 1982.
0°-8°
GAGE PLANE
0.12
SEATING PLANE
DETAIL A
MAB08AREVC
Figure 17. 8-Lead US8, JEDEC MO-187, Variation CA, 3.0mm Wide Package
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2007 Fairchild Semiconductor Corporation
FSA1259 / FSA1259A Rev. 1.0.6
10
www.fairchildsemi.com

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