UPD75P3018GC-3B9 데이터 시트보기 (PDF) - NEC => Renesas Technology

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UPD75P3018GC-3B9

4-BIT SINGLE-CHIP MICROCONTROLLER

NEC => Renesas Technology 

µPD75P3018

CONTENTS

1. PIN CONFIGURATION (Top View) .................................................................................................. 4

2. BLOCK DIAGRAM ........................................................................................................................... 5

3. PIN FUNCTIONS .............................................................................................................................. 6

3.1 Port Pins .................................................................................................................................................... 6

3.2 Non-port Pins ............................................................................................................................................ 8

3.3 Pin Input/Output Circuits .......................................................................................................................... 10

3.4 Recommended Connection for Unused Pins ......................................................................................... 12

4. SWITCHING FUNCTION BETWEEN Mk I AND Mk II MODE .......................................................... 13

4.1 Difference between Mk I Mode and Mk II Mode ...................................................................................... 13

4.2 Setting of Stack Bank Selection Register (SBS) .................................................................................... 14

5. DIFFERENCES BETWEEN µPD75P3018 AND µPD753012, 753016, AND 753017....................... 15

6. MEMORY CONFIGURATION ........................................................................................................... 16

7. INSTRUCTION SET .......................................................................................................................... 20

8. ONE-TIME PROM (PROGRAM MEMORY) WRITE AND VERIFY ................................................... 30

8.1 Operation Modes for Program Memory Write/Verify ............................................................................. 30

8.2 Program Memory Write Procedure .......................................................................................................... 31

8.3 Program Memory Read Procedure .......................................................................................................... 32

8.4 One-time PROM Screening ...................................................................................................................... 33

9. ELECTRICAL CHARACTERISTICS ................................................................................................ 34

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10. PACKAGE DRAWINGS ................................................................................................................... 48

11. RECOMMENDED SOLDERING CONDITIONS ................................................................................ 50

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APPENDIX A µPD75316B, 753017 AND 75P3018 FUNCTION LIST ................................................... 51

APPENDIX B DEVELOPMENT TOOLS ................................................................................................ 53

APPENDIX C RELATED DOCUMENTS ................................................................................................ 57

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