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FSQ0365(2007_05) 데이터 시트보기 (PDF) - Fairchild Semiconductor

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FSQ0365 Datasheet PDF : 24 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. TA = 25°C, unless otherwise specified.
Symbol
Characteristic
Min.
Max.
Unit
VSTR
VDS
VCC
VFB
VSync
Vstr Pin Voltage
Drain Pin Voltage
Supply Voltage
Feedback Voltage Range
Sync Pin Voltage Range
500
V
650
V
20
V
-0.3
9.0
V
-0.3
9.0
V
FSQ0365
12
IDM
Drain Current Pulsed(6)
FSQ0265
FSQ0165
8
A
4
FSQ321/311
1.5
FSQ0365
230
EAS
Single Pulsed Avalanche Energy(7)
FSQ0265
FSQ0165
140
mJ
50
FSQ321/311
10
PD
TJ
TA
TSTG
ESD
Total Power Dissipation
Recommended Operating Junction Temperature
Operating Ambient Temperature
Storage Temperature
Human Body Model(8)
Machine Model(8)
1.5
W
-40
Internally limited
°C
-40
85
°C
-55
150
°C
CLASS1 C
CLASS B
Notes:
6. Repetitive rating: Pulse width limited by maximum junction temperature.
7. L=51mH, starting TJ=25°C.
8. Meets JEDEC standards JESD22-A114 and JESD22-A115.
Thermal Impedance(9)
Symbol
Parameter
8-DIP
θJA(10)
θJC(11)
θJT(12)
Junction-to-Ambient Thermal Resistance
Junction-to-Case Thermal Resistance
Junction-to-Top Thermal Resistance
Notes:
9. All items are tested with the standards JESD 51-2 and 51-10 (DIP).
10. Free-standing, with no heat-sink, under natural convection.
11. Infinite cooling condition - refer to the SEMI G30-88.
12. Measured on the package top surface.
Value
80
20
35
Unit
°C/W
© 2006 Fairchild Semiconductor Corporation
FSQ0365, FSQ0265, FSQ0165, FSQ321, FSQ311 Rev. 1.0.4
5
www.fairchildsemi.com

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