GS-R24F0001.0 데이터 시트보기 (PDF) - STMicroelectronics

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GS-R24F0001.0

2 A DC-DC converter modules

STMicroelectronics 

Application information

GS-R24F

4.9

Soldering

Soldering phase has to be execute with care : in order to avoid undesired melting

phenomenon, particular attention has to be take on the set up of the peak temperature.

Here following some suggestions for the temperature profile based on

IPC/JEDEC J-STD-020C ,July 2004 recommendations.

Table 7.

Soldering

Profile feature

Average ramp up rate ( TSMAX to TP)

Preheat

Temperature min ( TS MIN)

Temperature max ( TS MAX)

Time (TS MIN to TS MAX) ( tS )

Time maintained above :

Temperature TL

Time tL

Peak temperature (TP)

Time within 5 °C of actual peak temperature (tP)

Ramp down rate

Time from 25 °C to peak temperature

PB free assembly

3 °C / sec max

150 °C

200 °C

60 – 100 sec

217 °C

40 – 70 sec

240 + 0 °C

10 – 20 sec

6 °C / sec

8 minutes max

Figure 2. Soldering

8/13

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