H11L1MSV 데이터 시트보기 (PDF) - Fairchild Semiconductor

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H11L1MSV

6-PIN DIP OPTOISOLATORS LOGIC OUTPUT

Fairchild Semiconductor 

6-PIN DIP

OPTOISOLATORS LOGIC OUTPUT

H11L1M

H11L2M

H11L3M

Package Dimensions (Through Hole)

0.350 (8.89)

0.320 (8.13)

0.260 (6.60)

0.240 (6.10)

Package Dimensions (Surface Mount)

0.350 (8.89)

0.320 (8.13)

0.390 (9.90)

0.260 (6.60) 0.332 (8.43)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.014 (0.36)

0.010 (0.25)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.100 (2.54)

0.320 (8.13)

15°

0.012 (0.30)

Package Dimensions (0.4” Lead Spacing)

0.350 (8.89)

0.320 (8.13)

0.260 (6.60)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.014 (0.36)

0.010 (0.25)

0.200 (5.08)

0.115 (2.93)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.100 [2.54]

0.012 (0.30)

0.008 (0.21)

0.425 (10.80)

0.400 (10.16)

NOTE

All dimensions are in inches (millimeters)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.025 (0.63)

0.020 (0.51)

0.020 (0.50)

0.016 (0.41)

0.014 (0.36)

0.010 (0.25)

0.320 (8.13)

0.012 (0.30)

0.008 (0.20)

0.100 [2.54]

0.035 (0.88)

0.006 (0.16)

Recommended Pad Layout for

Surface Mount Leadform

0.070 (1.78)

0.060 (1.52)

0.425 (10.79)

0.100 (2.54)

0.305 (7.75)

0.030 (0.76)

© 2003 Fairchild Semiconductor Corporation

Page 6 of 9

3/24/03

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