H2N7002KSN 데이터 시트보기 (PDF) - Hi-Sincerity Mocroelectronics
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H2N7002KSN Datasheet PDF : 4 Pages
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HI-SINCERITY
MICROELECTRONICS CORP.
SOT-323 (SC-70) Dimension
Spec. No. : MOS200809
Issued Date : 2008.11.18
Revised Date :2010.04.14
Page No. : 3/4
A
L
3
S
B
1
G
2
D
C
H
K
3-Lead SOT-323 Plastic
Surface Mounted Package
HSMC Package Code: SN
Marking:
DIM Min. Max.
A
1.80 2.20
B
1.15 1.35
C
0.80 1.00
D
0.30 0.40
G
1.20 1.40
H
0.00 0.10
J
0.10 0.25
Note: Pb-free product can distinguish by the green
label or the extra description on the right
side of the label.
K
0.425 (REF)
L
0.65 (BSC)
N
0.70 (REF)
Pin Style: 1.Gate 2.Source 3.Drain
S
2.00 2.40
Material:
Unit: mm
• Lead solder plating: Sn60/Pb40 (Normal),
N
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
J
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office
• Head Office (Hi-Sincerity Microelectronics Corp.): 5/F., Golden Harvest Building 15 Wang Chiu Road, Kowloon Bay, Hong Kong
Tel: +852-2755-7162 Fax: +852-2755- 7795
AVANTICS : Shanghai Address: No.399, Cai Lum Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai 201210, China
Tel: +86(21) 61637118 Fax: +86(21)61637006
H2N7002KSN
HSMC Product Specification
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