HA-2510(2004) 데이터 시트보기 (PDF) - Intersil

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HA-2510
(Rev.:2004)

High Slew Rate Operational Amplifier

Intersil 

HA-2510/883

Die Characteristics

DIE DIMENSIONS:

65 mils x 57 mils x 19 mils

1650µm x 1450µm x 483µm

METALLIZATION:

Type: Al, 1% Cu

Thickness: 16kÅ ± 2kÅ

GLASSIVATION:

Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)

Silox Thickness: 12kÅ ± 2kÅ

Nitride Thickness: 3.5kÅ ± 1.5kÅ

WORST CASE CURRENT DENSITY:

0.3 x 105 A/cm2

SUBSTRATE POTENTIAL (Powered Up):

Unbiased

TRANSISTOR COUNT:

HA-2510/883: 40

PROCESS: Bipolar Dielectric Isolation

Metallization Mask Layout

HA-2510/883

+IN

-IN

BAL

COMP

V-

V+

BAL

OUT

5

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