Solder Reflow Temperature Profile
300
PREHEATING RATE 3˚C + 1˚C/–0.5˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC. PEAK
TEMP.
245˚C
200
160˚C
150˚C
140˚C
100
2.5˚C ± 0.5˚C/SEC.
3˚C + 1˚C/–0.5˚C
PREHEATING TIME
150˚C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240˚C
PEAK
TEMP.
230˚C
SOLDERING
TIME
200˚C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Regulatory Information
The HCPL-3180 is pending
approval by the following
organizations:
DIN EN 60747-5-2
Pending approval under DIN
EN-60747-5-2 with VIORM = 630
VPEAK
UL
Approval under UL 1577,
component recognition program
up to VISO = 2500 VRMS. Pending
3750 VRMS.
CSA
Approval under CSA
Component.
3