HI-1565(2006) 데이터 시트보기 (PDF) - Holt Integrated Circuits

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HI-1565
(Rev.:2006)

MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers

Holt Integrated Circuits 

HI-1565, HI-1566

TXA/B

TRANSMITTER

BUSA/B

1:1.79

Point

“AT” 1:1.4

52.5 W

(.75 Zo)

TXA/B

TXINHA/B

35 W (.5 Zo)

BUSA/B

Isolation

Transformer

Coupling

Transformer

52.5 W

(.75 Zo)

52.5 W

(.75 Zo)

1.4:1

Point

“AT” 1.79:1

RECEIVER

52.5 W

(.75 Zo)

Coupling

Transformer

Isolation

Transformer

RXENA/B

Figure 3. Transformer Coupled Test Circuits

35 W (.5 Zo)

RXA/B

RXA/B

HEAT SINK - ESOIC & CHIP-SCALE PACKAGE

Both the HI-1565PSI/T/M and HI-1566PSI/T/M use a

20-pin thermally enhanced SOIC package. The

HI-1565PCI/T and HI-1566PCI/T use a plastic chip-scale

package. These packages include a metal heat sink

located on the bottom surface of the device. This heat

sink should be soldered down to the printed circuit board

for optimum thermal dissipation. The heat sink is

electrically isolated and may be soldered to any

convenient power or ground plane..

THERMAL CHARACTERISTICS

PART NUMBER PACKAGE STYLE CONDITION

HI-1565PSI / T / M

HI-1566PSI / T / M

20-pin Thermally

enhanced plastic

SOIC (ESOIC)

HI-1565CDI / T / M

HI-1566CDI / T / M

HI-1565PCI / T

HI-1566PCI / T

20-pin Ceramic

side-brazed DIP

44-pin Plastic chip-

scale package

Heat sink

unsoldered

Heat sink

soldered

Socketed

Heat sink

unsoldered

JUNCTION TEMPERATURE

ØJA

TA=25°C TA=85°C TA=125°C

54°C/W 62°C 122°C 162°C

47°C/W 57°C 117°C 157°C

62°C/W 69°C 129°C 169°C

49°C/W 59°C 119°C 159°C

Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled.

APPLICATIONS NOTE

Holt Applications Note AN-500 provides circuit design

notes regarding the use of Holt's family of MIL-STD-1553

transceivers. Layout considerations, as well as

recommended interface and protection components are

included.

HOLT INTEGRATED CIRCUITS

6

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