HI-1565 데이터 시트보기 (PDF) - Holt Integrated Circuits

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HI-1565

MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers

Holt Integrated Circuits 

HI-1565, HI-1566

VDD

Each Bus

TXA/B

TXA/B

RXA/B

RXA/B

MIL-STD-1553

Transceiver

Isolation

Transformer BUS A/B

55W

1:2.5

BUS A/B 55W

35W

HI-1565 / HI-1566

GND

Figure 3. Direct Coupled Test Circuit

Point

“AD”

VDD

Each Bus

TXA/B

Isolation

Transformer BUS A/B

TXA/B

RXA/B

MIL-STD-1553

Transceiver

70W

BUS A/B

RXA/B

1:1.79

HI-1565 / HI-1566

GND

Figure 4. Transformer Coupled Test Circuit

Point

“AT”

HEAT SINK - ESOIC & CHIP-SCALE

PACKAGE

Both the HI-1565PSI/T/M and HI-1566PSI/T/M use a 20-

pin thermally enhanced SOIC package. The HI-1565PCI/T

and HI-1566PCI/T use a plastic chip-scale package. These

packages include a metal heat sink located on the bottom

surface of the device. This heat sink should be soldered

down to the printed circuit board for optimum thermal

dissipation. The heat sink is electrically isolated and may

be soldered to any convenient power or ground plane.

APPLICATIONS NOTE

Holt Applications Note AN-500 provides circuit design notes

regarding the use of Holt's family of MIL-STD-1553

transceivers. Layout considerations, as well as

recommended interface and protection components are

included.

THERMAL CHARACTERISTICS

PART NUMBER PACKAGE STYLE

HI-1565PSI / T / M

HI-1566PSI / T / M

20-pin Thermally

enhanced plastic

SOIC (ESOIC)

HI-1565CDI / T / M

HI-1566CDI / T / M

HI-1565PCI / T

HI-1566PCI / T

20-pin Ceramic

side-brazed DIP

44-pin Plastic chip-

scale package

CONDITION

Heat sink

unsoldered

Heat sink

soldered

Socketed

Heat sink

unsoldered

JUNCTION TEMPERATURE

ØJA

TA=25°C TA=85°C TA=125°C

54°C/W 62°C 122°C 162°C

47°C/W 57°C 117°C 157°C

62°C/W 69°C 129°C 169°C

49°C/W 59°C 119°C 159°C

Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled.

HOLT INTEGRATED CIRCUITS

6

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