HI-1573 데이터 시트보기 (PDF) - Holt Integrated Circuits

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HI-1573

MIL-STD-1553 3.3V Monolithic Dual Transceivers

Holt Integrated Circuits 

HI-1573, HI-1574

VDD

Each Bus

TXA/B

TXA/B

RXA/B

RXA/B

Isolation

Transformer

MIL-STD-1553

Transceiver

1:2.5

HI-1573 / HI-1574

55W BUS A/B

35W

55W BUS A/B

GND

Figure 3. Direct Coupled Test Circuit

VDD

Each Bus

Point

“AD”

TXA/B

Isolation

Transformer BUS A/B

TXA/B

RXA/B

MIL-STD-1553

Transceiver

70W

BUS A/B

RXA/B

1:1.79

HI-1573 / HI-1574

GND

Figure 4. Transformer Coupled Test Circuit

Point

“AT”

HEAT SINK - ESOIC & CHIP-SCALE The heat sink is electrically isolated and may be soldered to

PACKAGE

any convenient power or ground plane.

Both the HI-1573PSI/T/M and HI-1574PSI/T/M use a 20-pin APPLICATIONS NOTE

thermally enhanced SOIC package. The HI-1573PCI/T/M

and HI-1574PCI/T/M use a plastic chip-scale package Holt Applications Note AN-500 provides circuit design notes

(QFN). These packages include a metal heat sink located regarding the use of Holt's family of MIL-STD-1553

on the bottom surface of the device. This heat sink should transceivers. Layout considerations, as well as

be soldered down to the printed circuit board for optimum recommended interface and protection components are

thermal dissipation.

included.

THERMAL CHARACTERISTICS

PART NUMBER PACKAGE STYLE CONDITION

HI-1573PSI / T / M 20-pin Thermally

enhanced plastic SOIC

HI-1574PSI / T / M

(ESOIC)

HI-1573CDI / T / M

HI-1574CDI / T / M

HI-1573PCI / T / M

HI-1574PCI / T / M

20-pin Ceramic

side-brazed DIP

44-pin Plastic chip-

scale package (QFN)

Heat sink

unsoldered

Heat sink

soldered

Socketed

Heat sink

unsoldered

JUNCTION TEMPERATURE

ØJA

TA=25°C TA=85°C TA=125°C

54°C/W 52°C 112°C 152°C

47°C/W 49°C 109°C 149°C

62°C/W 56°C 116°C 156°C

49°C/W 50°C 110°C 150°C

Data taken at VDD=3.3V, continuous transmission at 1Mbit/s, single transmitter enabled.

HOLT INTEGRATED CIRCUITS

6

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