HI-3183CLT 데이터 시트보기 (PDF) - Holt Integrated Circuits

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HI-3183CLT

ARINC 429 Differential Line Driver

Holt Integrated Circuits 

HI-318X PACKAGE DIMENSIONS

16-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB

(Wide Body, Thermally Enhanced)

.405 ± .008

(10.287 ± .20)

.0105 ± .0015

(.2667 ± .038)

inches (millimeters)

Package Type: 16HWE

.240

(6.10)

typ

.407 ± .013

(10.34 ± .32)

Top View

.295 ± .004

(7.49 ± .10)

.190

(4.83)

typ

Bottom

View

.050

(1.27)

BSC

.0165 ± .003

(.419 ± .089)

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

See Detail A

0° to 8°

.033 ± .017

(.838 ± .432)

.090 ± .010

(2.286 ± .254)

Electrically isolated heat sink

pad on bottom of package.

Connect to any ground or

power plane for optimum

thermal dissipation.

.0025 ± .002

(.064 ± .038)

Detail A

16-PIN CERAMIC SIDE-BRAZED DIP

inches (millimeters)

Package Type: 16C

.810

(20.574)

max

.125 min

(3.175)

PIN 1

.200

(5.080)

max

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

.018 ± .002

(.457 ±.051)

.295 ±.010

(7.493 ±.254)

.050 ±.005

(1.270 ±.127)

.035 ± .010

(.889 ±.254)

BASE

PLANE

SEATING

PLANE

.100

(2.54) BSC

.010 ±.002

(.254 ±.051)

.300 ± .010

(7.620 ±.254)

HOLT INTEGRATED CIRCUITS

10

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