HLMP-EG08 데이터 시트보기 (PDF) - HP => Agilent Technologies
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HLMP-EG08 Datasheet PDF : 12 Pages
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6
Package Dimensions
A
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
31.60
(1.244)
MIN.
CATHODE
LEAD
0.70 (0.028)
MAX.
2.35 (0.093)
MAX.
1.00 MIN.
(0.039)
CATHODE
FLAT
0.50
(0.020
±
±
0.10
0.004)
SQ.
TYP.
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
B
d
31.60
(1.244)
MIN.
CATHODE
LEAD
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
1.50 ± 0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
1.00 MIN.
(0.039)
CATHODE
FLAT
0.50
(0.020
±
±
0.10
0.004)
SQ.
TYP.
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL, SOLDER DIPPED.
3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
4. RECOMMENDED PC BOARD HOLE DIAMETERS:
• LAMP PACKAGE A WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 (0.044/0.042).
• LAMP PACKAGE B WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS
= 0.965/0.889 (0.038/0.035).
5. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE
B, SEE TABLE.
PART NO.
d
HLMP-XX10
HLMP-XX17
12.37 ± 0.25
(0.487 ± 0.010)
12.42 ± 0.25
(0.489 ± 0.010)
HLMP-XX26 12.52 ± 0.25
(0.493 ± 0.010)
HLMP-XX32 11.96 ± 0.25
(0.471 ± 0.010)
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