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HLMP-HG64 데이터 시트보기 (PDF) - Avago Technologies

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HLMP-HG64 Datasheet PDF : 12 Pages
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Example of Wave Soldering Temperature Profile for TH LED
260°C Max
105°C Max
60 sec Max
TIME (sec)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
Ammo Packs Drawing
6.35±1.30
0.25±0.0512
12.70±1.00
0.50±0.0394
CATHODE
9.125±0.625
0.3593±0.0246
18.00±0.50
0.7087±0.0197
12.70±0.30
0.50±0.0118
Note: All dimensions in millimeters/(inches)
A
A
0.70±0.20 VIEW A -A
0.0276±0.0079
20.50±1.00
0.8071±0.0394
Ø
4.00±0.20
0.1575±0.008
TYP
10

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