HM-6518883 데이터 시트보기 (PDF) - Intersil

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HM-6518883

1024 x 1 CMOS RAM

Intersil 

HM-6518/883

Die Characteristics

DIE DIMENSIONS:

130 x 150 x 19 ±1mils

METALLIZATION:

Type: Si - Al

Thickness: 11kÅ ±2kÅ

GLASSIVATION:

Type: SiO2

Thickness: 8kÅ ±1kÅ

WORST CASE CURRENT DENSITY:

1.342 x 105 A/cm2

Metallization Mask Layout

HM-6518/883

E

S1

VCC

S2

D

A0

W

A1

A9

A2

A3

A8

A7

A4

Q

GND

NOTE: Pin numbers correspond to DIP package only.

A6

A5

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