HMHA2801V 데이터 시트보기 (PDF) - Fairchild Semiconductor

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HMHA2801V

HALF PITCH MINI-FLAT PACKAGE 4-PIN OPTOCOUPLERS

Fairchild Semiconductor 

HMHAA280

HALF PITCH MINI-FLAT PACKAGE

4-PIN OPTOCOUPLERS

HMHA2801 SERIES

Footprint Drawing for PCB Layout

0.024 (0.61)

0.060 (1.52)

0.310 (7.87)

0.190 (4.83)

HMHA281

0.050 (1.27)

Recommended Infrared Reflow Soldering Profile

180°C

(heating)

to 30 s

230°C (peak temperature)

210°C

to 60 s

150 s

90 s

60 s

Time (s)

• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds

• Time of temperature higher than 210°C: 60 seconds or less

• One time soldering reflow is recommended

© 2002 Fairchild Semiconductor Corporation

Page 8 of 9

9/30/03

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