HSP061-8M16 데이터 시트보기 (PDF) - STMicroelectronics

부품명

상세내역

제조사

HSP061-8M16

8-line ESD protection for high speed lines

STMicroelectronics 

Package information

2

Package information

HSP061-8M16

• Epoxy meets UL94, V0

• Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

INDEX AREA

(D/2 x E/2)

PIN # 1 ID

L

A

Figure 8. µQFN-16L dimensions

Dimensions

Ref.

Millimeters

Inches

e

b

EXPOSED PAD

E2 E

K

D2

D

A1

Min. Typ. Max. Min. Typ. Max.

A 0.50 0.55 0.60 0.020 0.022 0.024

A1 0.00 0.02 0.05 0.000 0.001 0.002

b 0.15 0.20 0.25 0.006 0.008 0.010

D 3.20 3.30 3.40 0.126 0.130 0.134

D2 2.45 2.60 2.70 0.096 0.102 0.106

E 1.40 1.50 1.60 0.055 0.059 0.063

E2 0.20 0.35 0.45 0.008 0.014 0.018

e

0.40

0.016

K 0.20

0.008

L 0.20 0.30 0.40 0.008 0.012 0.016

Figure 9. Footprint recommendations

(dimensions in mm)

Figure 10. Marking

0.40

0.20

0.45

0.40

2.80

3.00

0.85 1.75

Dot: Pin 1

XX XX: Marking

WW WW: Assembly week

Y: Assembly year

Y P P: Assembly plant

4/10

DocID18055 Rev 3

Share Link: