HT12M 데이터 시트보기 (PDF) - Holtek Semiconductor
부품명
상세내역
제조사
HT12M Datasheet PDF : 6 Pages
| |||
HT12M
Pad Assignment
Pad Coordinates
Pad No.
1
A2
1 16 15 14
13 12
11
2
3
A3
2
A4 3
A5
4
10
AM P
4
5
9
D IN
6
(0 , 0 )
7
8
9
10
11
12
13
8
567
14
15
A6 A7 VSS
AUD
16
Chip Size: 1530 ´ 1690 mm
* The IC substrate should be connected to VSS in the PCB layout artwork.
X
-610.00
-622.00
-622.00
-622.00
-616.00
-502.00
-388.50
-87.95
575.80
575.80
308.30
22.10
-122.40
-270.40
-384.50
-495.50
Pin Description
Pin No. Pin Name I/O Internal Connection
Description
1~8 A0~A7
I
NMOS
Open Drain
Address pin.
9 VSS
10 AUD
11 DIN
12 AMP
¾
¾
Negative power supply, ground
O
PMOS
Open Drain
Audio out
I
COMS In
Serial data input
O
CMOS
Amp feed back
13 OSCI
I
¾
Oscillator input pin.
14 VT
O
CMOS
Busy, data valid
15 TEST
I
CMOS In
Test pin.
16 VDD
¾
¾
Positive power supply
Unit: mm
Y
701.90
461.60
350.60
239.70
-695.20
-695.20
-687.70
-647.80
172.40
444.20
660.40
635.90
638.40
701.90
701.90
701.90
Absolute Maximum Ratings
Supply Voltage ........................................-0.3V to 5.5V
Input Voltage .............................VSS-0.3V to VDD+0.3V
Storage Temperature ...........................-50°C to 125°C
Operating Temperature ..........................-25°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
Rev. 1.00
2
March 25, 2002
Share Link: 