HT48R064 데이터 시트보기 (PDF) - Holtek Semiconductor

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HT48R064

Enhanced I/O Type 8-Bit OTP MCU

Holtek Semiconductor 

HT48R063/064/065/066/0662/067

Pin Name Function OPT I/T O/T

Description

PC3/PWM1

PCn PCPU ST CMOS General purpose I/O. Register enabled pull-up.

PWM1 CTRL1 ¾ CMOS PWM output

PC4/XT2

PCn PCPU ST CMOS General purpose I/O. Register enabled pull-up.

XT2

CO ¾ LXT Low frequency crystal pin

PC5/XT1

PD0, PD1

PD3~PD7

PCn PCPU ST CMOS General purpose I/O. Register enabled pull-up.

XT1

CO ¾ LXT Low frequency crystal pin

PDn PDPU ST CMOS General purpose I/O. Register enabled pull-up.

PD2/TC2

PE0~PE7

PDn PDPU ST CMOS General purpose I/O. Register enabled pull-up.

TC2

¾ ST ¾ External Timer 2 clock input - HT48R0662 doesn¢t have TC2

PEn PEPU ST CMOS General purpose I/O. Register enabled pull-up.

PF0, PF1

PFn PFPU ST CMOS General purpose I/O. Register enabled pull-up.

VDD

VDD

¾ PWR ¾ Power supply

VSS

VSS

¾ PWR ¾ Ground

Note:

I/T: Input type; O/T: Output type

OPT: Optional by configuration option (CO) or register option

PWR: Power; CO: Configuration option

ST: Schmitt Trigger input; CMOS: CMOS output

SCOM: Software controlled LCD COM

HXT: High frequency crystal oscillator

LXT: Low frequency crystal oscillator

Absolute Maximum Ratings

Supply Voltage ...........................VSS-0.3V to VSS+6.0V

Input Voltage..............................VSS-0.3V to VDD+0.3V

IOL Total ..............................................................100mA

Total Power Dissipation .....................................500mW

Storage Temperature ............................-50°C to 125°C

Operating Temperature...........................-40°C to 85°C

IOH Total............................................................-100mA

Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed

in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

Rev. 1.40

9

October 23, 2012

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