HT9315 데이터 시트보기 (PDF) - Holtek Semiconductor

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HT9315

15-Memory Tone/Pulse Dialer

Holtek Semiconductor 

HT9315 Series

Pin Name

I/O

Internal

Connection

Description

This pin is a Schmitt trigger input structure. Active high. Applying a positive pulse

HFI

I

CMOS IN to HFI can toggle the HFO once and hence control the hand-free function. The

Pull-Low pull-low resistance of HFI is 200kW typ.

An external RC network is recommended for input debouncing.

HFO

The HFO is a CMOS output structure. Its output is toggle- controlled by a positive

transition on HFI pin. When HFO is high, the hand-free function is enabled and PO

O

CMOS OUT

outputs a high to connect the line.

The hand-free function can be released by setting HDO high or by an on-off-hook op-

eration or by another HFI input. Refer to the functional description for the hand-free

functional operation.

DOUT

NMOS open drain output pin. It outputs the BCD code of the dialing digits to the

O NMOS OUT LCD driver chip (HT16XX series) or MCU for dialing number display. Refer to the

functional description for the detailed timing.

CLOCK

O

NMOS OUT

NMOS open drain output. When dialing, it outputs a series of pulse trains for

DOUT data synchronization. DOUT data is valid at the falling edge of the clock.

VDD

¾

¾

Positive power supply, 2.0V~5.5V for normal operation

VSS

¾

¾

Negative power supply, ground

Approximate internal connection circuits

C M O S IN /O U T

VDD

NM OS OUT

C M O S IN

CM OS OUT

VDD

C M O S IN

P u ll- H ig h

C M O S IN

P u ll- L o w

O S C IL L A T O R

X1

X2

20P

10M

10P

EN

Absolute Maximum Ratings

Supply Voltage ...........................................-0.3V to 6V

Storage Temperature ...........................-50°C to 125°C

Input Voltage .............................. VSS-0.3 to VDD+0.3V

Operating Temperature ..........................-20°C to 75°C

Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

Rev. 1.20

4

October 1, 2002

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