HV830LG-G 데이터 시트보기 (PDF) - Supertex Inc
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HV830LG-G Datasheet PDF : 6 Pages
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HV830
8-Lead SOIC (Narrow Body) Package Outline (LG)
4.9x3.9mm body, 1.75mm height (max), 1.27mm pitch
D
θ1
8
E
E1
Note 1
(Index Area
D/2 x E1/2)
1
Top View
A A2
A1
Seating
Plane
e
b
Side View
Note 1
h
L
L1
View B
h
L2
Gauge
Plane
Seating
θ
Plane
View B
View A-A
Note 1:
This chamfer feature is optional. If it is not present, then a Pin 1 identifier must be located in the index area indicated.The Pin 1 identifier may be either a
mold, or an embedded metal or marked feature.
Symbol
A
A1 A2
b
D
E
E1
e
h
L
L1 L2
θ
θ1
MIN 1.35 0.10 1.25 0.31 4.80 5.80 3.80
0.25 0.40
0O
5O
Dimension
(mm)
NOM
-
-
-
-
4.90
6.00
3.90
1.27
BSC
-
-
1.04 0.25
REF BSC
-
-
MAX 1.75 0.25 1.50 0.51 5.00 6.20 4.00
0.50 1.27
8O
15O
JEDEC Registration MS-012, Variation AA, Issue E, Sept. 2005.
Drawings not to scale.
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information go to http://www.supertex.com/packaging.html.)
Doc. # DSFP-HV830
C081507
6
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