HX6256NSRC 데이터 시트보기 (PDF) - Honeywell International

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HX6256NSRC

32K x 8 Static RAM

Honeywell International 

HX6256

PACKAGING

The 32K x 8 SRAM is offered in two custom 36-lead flat

packs, a 28-Lead FP, or standard 28-lead DIP. Each

package is constructed of multilayer ceramic (Al2O3) and

features internal power and ground planes. The 36-lead

flat packs also feature a non-conductive ceramic tie bar

on the lead frame. The tie bar allows electrical testing of

the device, while preserving the lead integrity during

shipping and handling, up to the point of lead forming

and insertion.

28-LEAD DIP & FP PINOUT

On the bottom brazed 36-lead FP, ceramic chip

capacitors can be mounted to the package by the user to

maximize supply noise decoupling and increase board

packing density. These capacitors connect to the internal

package power and ground planes. This design

minimizes resistance and inductance of the bond wire

and package. All NC (no connect) pins must be

connected to either VDD, VSS or an active driver to

prevent charge build up in the radiation environment.

36-LEAD FP PINOUT

28-LEAD FLAT PACK (22017842-001)

All dimensions in inches

A 0.105 ± 0.015

b 0.017 ± 0.002

C 0.003 to 0.006

D 0.720 ± 0.008

e 0.050 ± 0.005 [1]

E 0.500 ± 0.007

E2 0.380 ± 0.008

E3 0.060 ref

F 0.650 ± 0.005 [2]

G 0.035 ± 0.004

L 0.295 min [3]

Q 0.026 to 0.045

S 0.045 ± 0.010

U 0.130 ref

W 0.050 ref

X 0.075 ref

Y 0.010 ref

[1] BSC – Basic lead spacing between centers

[2] Where lead is brazed to package

[3] Parts delivered with leads unformed

[4] Lid connected to VSS

28-LEAD DIP (22017785-001)

For 28-Lead DIP description, see MIL-STD-1835, Type CDIP2-T28, Config. C, Dimensions D-10

www.honeywell.com/radhard

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