IZ74LV04 데이터 시트보기 (PDF) - Integral Corp.

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IZ74LV04

HEX INVERTER

Integral Corp. 

IN74LV04

MAXIMUM RATINGS*

Symbol

Parameter

Value

Unit

VCC DC supply voltage (Referenced to GND)

-0.5 ÷ +7.0

V

IIK*1 DC input diode current

±20

mA

IOK*2 DC output diode current

±50

mA

Io*3 DC output source or sink current

±25

mA

-bus driver outputs

IGND DC GND current for types with

±50

mA

- bus driver outputs

ICC DC VCC current for types with

±50

mA

- bus driver outputs

PD Power dissipation per package, plastic DIP+

750

mW

SOIC

500

package+

Tstg Storage temperature

-65 ÷ +150

°C

TL Lead temperature, 1.5 mm from Case for 10

260

°C

seconds

(Plastic DIP ), 0.3 mm (SOIC Package)

*Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

+Derating - Plastic DIP: - 12 mW/°C from 70° to 125°C

SOIC Package: : - 8 mW/°C from 70° to 125°C

*1: VI < -0.5V or VI > VCC+0.5V

*2: Vo < -0.5V or Vo > VCC+0.5V

*3: -0.5V < Vo < VCC+0.5V

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min Max Unit

VCC

DC Supply Voltage (Referenced to GND)

1.0 5.5 V

VIN, VOUT DC Input Voltage, Output Voltage (Referenced to 0

VCC

V

GND)

TA

Operating Temperature, All Package Types

-40 +125 °C

tr, tf

Input Rise and Fall Time

VCC =1.2 V 0 1000 ns

VCC =2.0 V 0

700

VCC =3.0 V 0

500

VCC =3.6 V

0 400

This device contains protection circuitry to guard against damage due to high static

voltages or electric fields. However, precautions must be taken to avoid applications of any voltage

higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and

VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC.

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or

VCC). Unused outputs must be left open.

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