IRF7101
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)DSS
∆V(BR)DSS/∆TJ
RDS(ON)
VGS(th)
gfs
IDSS
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
LD
LS
Ciss
Coss
Crss
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Min. Typ. Max. Units
Conditions
20 ––– ––– V VGS = 0V, ID = 250µA
––– 0.025 ––– V/°C Reference to 25°C, ID = 1mA
––– ––– 0.10 Ω
––– ––– 0.15
VGS = 10V, ID = 1.8A
VGS = 4.5V, ID = 1.0A
1.0 ––– 3.0 V VDS = VGS, ID = 250µA
1.1 ––– ––– S VDS = 15V, ID = 3.5A
––– ––– 2.0 µA VDS = 20V, VGS = 0V
––– ––– 250
VDS = 16V, VGS = 0V, TJ = 125 °C
––– ––– 100 nA VGS = 12V
––– ––– -100
VGS = - 12V
––– ––– 15
ID = 1.8A
––– ––– 2.0
––– ––– 3.6
nC VDS = 16V
VGS = 10V
––– 7.0 –––
VDD = 10V
––– 10 ––– ns ID = 1.8A
––– 24 –––
RG = 8.2Ω
––– 30 –––
RD = 26Ω
D
––– 4.0 –––
nH Between lead,6mm(0.25in.)
from package and center G
––– 6.0 –––
of die contact
S
––– 320 –––
VGS = 0V
––– 250 ––– pF VDS = 15V
––– 75 –––
ƒ = 1.0MHz
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse RecoveryCharge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
––– ––– 2.0
––– ––– 14
––– ––– 1.2
––– 36 54
––– 41 62
MOSFET symbol
D
showing the
A
integral reverse
G
p-n junction diode.
S
V TJ = 25°C, IS = 1.7A, VGS = 0V
ns TJ = 25°C, IF = 1.7A
nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by
max. junction temperature.
ISD ≤ 3.5A, di/dt ≤ 90A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 150°C
Pulse width ≤ 300µs; duty cycle ≤ 2%.
Surface mounted on FR-4 board, t ≤ 10sec.