IRFZ46NS/IRFZ46NL
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage
55 V VGS = 0V, ID = 250µA
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient 0.057 V/°C Reference to 25°C, ID =1mA
RDS(on)
Static Drain-to-Source On-Resistance .0165 Ω VGS =10V, ID = 28A
VGS(th)
gfs
Gate Threshold Voltage
Forward Transconductance
2.0 4.0 V VDS = VGS, ID = 250µA
19 S VDS = 25V, ID = 28A
IDSS
Drain-to-Source Leakage Current
25 µA VDS = 55V, VGS = 0V
250
VDS = 44V, VGS = 0V, TJ = 150°C
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
100 n A VGS = 20V
-100
VGS = -20V
Qg
Total Gate Charge
Qgs
Gate-to-Source Charge
72
11
ID = 28A
nC VDS = 44V
Qgd
td(on)
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
26
14
VGS = 10V, See Fig. 6 and 13
VDD = 28V
tr
td(off)
Rise Time
Turn-Off Delay Time
76
52
ns
ID = 28A
RG = 12Ω
tf
Fall Time
LS
Internal Source Inductance
57
RD = 0.98Ω, See Fig. 10
7.5
nH
Between lead,
and center of die contact
Ciss
Input Capacitance
1696
VGS = 0V
Coss
Crss
EAS
Output Capacitance
Reverse Transfer Capacitance
Single Pulse Avalanche Energy
407 pF
110
583152
VDS = 25V
= 1.0MHz, See Fig. 5
IAS = 28A, L = 389mH
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
I SM
Pulsed Source Current
(Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
53
A showing the
integral reverse
G
180
p-n junction diode.
S
1.3 V TJ = 25°C, IS = 28A, VGS = 0V
67 101 ns TJ = 25°C, IF = 28A
208 312 nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Starting TJ = 25°C, L = 389µH
RG = 25Ω, IAS = 28A. (See Figure 12)
ISD ≤ 28A, di/dt ≤ 220A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 175°C.
Pulse width ≤ 400µs; duty cycle ≤ 2%.
Uses IRFZ46N data and test conditions.
This is a typical value at device destruction and represents
operation outside rated limits.
This is a calculated value limited to TJ = 175°C.
Calculated continuous current based on maximum allowable
junction temperature. Package limitation current is 39A.
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
2
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